Case Western Reserve University

Uziel Landau

Department Chair, Professor

B.S. Chemical Engineering, Technion Israel Institute of Technology, 1964
M.S. Chemical Engineering, Technion Israel Institute of Technology, 1967
Ph. D. Chemical Engineering, University of California, Berkeley, 1975

email: uxl@case.edu
office: A. W. Smith 123
telephone: (216)368-4132

Research

Electrochemical engineering; design of electrochemical systems and processes; electrodeposition; electropolishing; electrochemical processing of microelectronics devices

Selected Publications

Julie Mendez, Rohan Akolkar, Tatyana Andryushchenko and Uziel Landau, “A Mechanistic Model for Copper Electropolishing in Phosphoric Acid”, accepted for publication, J. Electrochem. Soc., Oct. 2007.

B. K. Purushothaman, and U. Landau, "Rapid Charging of Lithium Ion Batteries Using Pulsed Currents – A Theoretical Analysis”, J. Electrochem. Soc., 153, (3) A533-542 (2006)

Arun S. Agarwal, Uziel Landau, Xi Shan and Joe H. Payer, “Modeling the Cathodic Region in Crevice Corrosion Under a Thin Electrolyte Film Including Particulates, Symp. on Multiscale Simulations of Electrochemical Systems-Computational Aspects, 208th Electrochem. Soc. Meeting, Los Angeles, CA, Oct. 17-21, 2005. [ECS Trans. 1, Oct. (2005)]

B. K. Purushothaman, P. W. Morrison and U. Landau, "Reducing Mass Transport Limitations by the Application of Special Pulsed Current Modes”, J. Electrochem. Soc., 152 (4) J33-J39 (2005)

R. Akolkar and U. Landau, “A Time-Dependent Transport-Kinetics Model for Additives Interactions in Copper Interconnect Metallization”, J. Electrochem. Soc., 151 (11), C702 (2004).

R. Akolkar, U. Landau, H. Kuo and Yar-Ming Wang, “Modeling of the Current Distribution in Aluminum Anodization”, J. Appl. Electrochem., 34, 807-813 (2004).

T. Fulop, C. Bekele, U. Landau, J. Angus and K. Kash, “Electrodeposition of polycrystalline InSb from aqueous electrolytes”, Thin Solid Films, Volume 449, Issues 1-2, Pages 1-5, 2 February 2004.

R. Adelung, F. Ernst, N. Zheng, and U. Landau, “In-situ Nanoscale Observation and Control of Electron-Beam-Induced Cluster Formation”, JVST (J. Vacuum Science and Tech)-B 22, p. 1797 (2004).

R. Akolkar and U. Landau, “Analysis of the ‘Bottom-up’ Fill during Copper Metallization of Semiconductor Interconnects”, “Electrochemical Processing in ULSI and MEMS”, H. Deligianni, S. T. Mayer, T. P. Moffat, and G. R. Stafford, Editors, The Electrochemical Society Proceedings Series, Pennington, NJ (2004).

S. Agarwal, U. Landau and T. Zawodzinski, “Hydrogen Peroxide Formation During Oxygen Reduction On High Surface Area Pt/C Catalysts”, in “Proceedings of the Fourth International Symposium on Proton Conducting Membrane Fuel Cells”, J. VanZee, S.R. Narayanan, and M Murthy, eds., 206th Electrochemical Society Meeting, Honolulu, Hawaii, October 3-8 (2004).

Uziel Landau, Eugene Malyshev, Rohan Akolkar, and Sergey Chivilikhin, “Simulations of ‘Bottom-Up’ Fill In Via Plating of Semiconductor Interconnects”, Paper 189 d, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco, CA, (U. Landau, Ed.), Nov 16-21 (2003).