Department of Materials Science
and Engineering
400 White Building (7204)
phone 368-4230; fax 368-3209
Gary Michal; e-mail: gmm3@po.cwru.edu
Materials science and engineering is a discipline that extends from the basic science of materials structure and properties to the design and evaluation of materials in engineering systems. Most engineers -- mechanical, civil, chemical, electrical -- work with materials on the job, and many become well acquainted with the properties of the materials they use most often. The role of a materials engineer is to understand why materials behave as they do under various conditions; to recognize the limits of performance that particular materials can attain; and to know what can be done during the manufacture of materials to meet the demands of a given application.
The Department of Materials Science and Engineering of the Case School of Engineering offers programs leading to the Bachelor of Science in Engineering, Master of Science, and Doctor of Philosophy degrees. The department conducts academic and research activities with metals, ceramics, composites, and electronic materials. Increasingly, the demands for new materials, and for improved materials in existing applications, transcend the traditional categories. The technological challenges that materials engineers face will continue to demand a breadth of knowledge across the spectrum of engineering materials.
Materials science draws on chemistry in its concern for bonding, synthesis, and composition of engineering materials and their chemical interactions with the environment. Physics provides a basis for understanding the mechanical, thermal, and electrical properties of materials, as well as the tools needed to ascertain the structure and properties of materials. Mathematics is used throughout materials manufacture and analysis. Ultimately, however, materials is an engineering discipline, bringing basic science tools to bear on the technological challenges related to materials products and their manufacture.
Gary M. Michal, Ph.D. (Stanford University)
LTV Steel Professor and Chair
Physical metallurgy; rapid solidification technology; application of rapid annealing to nonequilibrium precipitation reactions; transmission electron microscopy; surface science; composite materials; interfacial phenomena.
Robert M. Aikin, Jr., Ph. D. (Michigan Technological University)
Associate Professor
Metal and composite processing; solidification; microstructural development; phase equilibria; in situ composites; intermetallics; structure-property relationships.
James D. Cawley, Ph.D. (Case Western Reserve University)
Great Lakes Associate Professor of Ceramic Processing
Powder processing of ceramics; aggregation phenomena; oxidation, diffusion, and solid state reactions; silicate and active metal brazing of ceramics; ceramic matrix composites.
Mark R. DeGuire, Ph.D. (Massachusetts Institute of Technology)
Associate Professor
Synthesis and properties of electrical ceramics in bulk and thin-film form, including dielectrics, ferroelectrics, semiconductors, superconductors, and ferrites; high-temperature phase equilibria; defect chemistry.
Arthur H. Heuer, Ph.D., D.Sc. (University of Leeds, England)
Kyocera Distinguished Professor
Transformation toughening and plastic deformation of ceramics; phase transformations in ceramics; biological ceramics; interphase interfaces in advanced structural composites; high resolution and analytical electron microscopy.
Peter Lagerlof, Ph.D. (Case Western Reserve University)
Associate Professor
Electron microscopy; high temperature mechanical properties of single crystal and polycrystal oxide and nitride ceramics; oxygen diffusion in oxide ceramics.
John J. Lewandowski, Ph.D. (Carnegie-Mellon University)
Professor
Mechanical behavior of materials; micromechanisms of deformation and fracture; composite materials; ductile phase toughening of brittle materials; high-pressure deformation and fracture studies; hydrostatic extrusion.
David H. Matthiesen, Ph.D. (Massachusetts Institute of Technology)
Assistant Professor
Crystal growth; electronic materials; materials processing in microgravity; effect of growth conditions on the microstructures and electrical properties of semiconductors; fluid dynamics and heat, mass, and momentum transport.
Joe H. Payer, Ph.D. (Ohio State University)
Professor
Electrochemistry and corrosion; reliability and life prediction; corrosion monitoring and sensors; polymer/metal adhesion.
P. Pirouz, Ph.D. (Imperial College of Science and Technology, England)
Professor
Defects in semiconductors; heteroepitaxial growth of electronic materials; diffraction theory; transmission electron microscopy and its applications in materials science; fiber-reinforced composites; synthetic growth of diamond.
Michael J. Saran, Ph.D. (Polish Academy of Sciences, Warsaw)
Associate Professor
Computer integrated manufacturing. Design of products, tools, and processes for net shape manufacturing (metal forming applications) and development of solution algorithms and software for numerical simulation of materials processing. Experimental studies of metal forming processes.
Gerhard E. Welsch, Ph.D. (Case Western Reserve University)
Professor
Metallic materials; titanium, tungsten, steels and metal-matrix composites; mechanical and high-temperature properties; ion implantation for surface modification integral structure design.
John Angus, Ph.D. (University of Michigan)
Professor of Chemical Engineering
Donald L. Feke, Ph.D. (Princeton University)
Associate Professor of Chemical Engineering
James W. Simmelink, Ph.D. (Case Western Reserve University)
Associate Professor of Dentistry
Chaim N. Sukenik (California Institute of Technology)
Professor of Chemistry
Russell Wang, D.D.S. (University of Toronto)
Assistant Professor of Dentistry
Mark R. Antonio
Professor
Argonne National Laboratory, Argonne, IL
Marc Constantino
Professor
Lawrence Livermore Laboratory, Livermore, CA
George Fischer
Professor
IVAC Technologies, Cleveland
N. J. Henry Holroyd
Professor
Alcan International Ltd., Oxon, England
Warren H. Hunt, Jr.
Professor
Alcoa, Pittsburgh, PA
Jennie S. Hwang
H-Technologies Group, Cleveland
Alain Kaloyeros
Professor
State University of New York, Albany
Terence Mitchell
Professor
Los Alamos National Laboratory, Los Alamos, NM
Shigehiro Nishino
Professor
Kyoto Institute of Technology, Kyoto, Japan
Gary Ruff
Professor
CMI International, Southfield, MI
Rolf Steinbrech
Professor
University of Dortmund, Germany
Peter F. Wieser
Professor
Wieser & Associates, Cleveland, OH
In addition to the Bachelor of Science degree program in materials science and engineering, the department also offers a minor in materials science and engineering. this sequence is intended primarily for students majoring in science or engineering, but it is open to any student with a sound background in introductory calculus, chemistry, and physics.
This program requires the completion of 5 courses with a minimum of 15 credit hours, of which a maximum of 6 hours can be counted toward the student's major. All students will be required to take EMSE 201 (3) and four of the following courses:
EMSE 202, Phase Diagrams and Phase Transformations (3)
EMSE 203, Applied Thermodynamics (3)
EMSE 260, Transport Phenomena (4)
EMSE 301, Fundamentals of Materials Processing (3)
EMSE 303, Mechanical Behavior of Materials (3)
EMSE 307, Foundry Metallurgy (3)
EMSE 313, Engineering Applications of Materials (3)
EMSE 314, Electrical, Magnetic, and Optical Properties (3)
EMSE 316, Applications of Ceramics (3)
EMSE 317, Diffraction Principles and Applications (4)
Prof. Mark DeGuire (412 White; x-6481) is the academic advisor for this program and will assist students with their course selection.
The department offers programs leading to the Master of Science and Doctor of Philosophy degrees with research specialties in metallurgy, ceramics, electronic materials, and materials science. A broad range of studies of the theory, properties, and engineering behavior of materials is encompassed in the academic courses and research within the department, with primary areas of specialization in materials processing, mechanical properties, surface and microstructural characterization, environmental effects, and electronic materials.
Determination of the relationships between structure and mechanical behavior of traditional and advanced materials: metals, ceramics, intermetallics, composites, and biological materials.
Ceramic and metal powder synthesis and processing, computer-aided manufacturing of laminated materials, metals casting, crystal growth, thin film deposition, deformation processing of metals.
Corrosion, oxidation, adhesion and wear. Electrodeposited coatings on steel, epoxy/metal adhesion, disbonding of pipeline coatings, reliability of electronics, corrosion sensors.
Free surfaces, grain boundaries, metal/ceramic, polymer/metal composite interfaces. Major facilities for transmission electron microscopy, scanning electron microcopy, and surface spectroscopies.
Electronic materials: silicon, germanium, gallium arsenide, silicon carbide; thin film dielectric, optical, and magnetic ceramics; synthesis and characterization of multicomponent ceramics, including barium titanate and materials for sensors, catalysts, and fuel cells.
The department's processing laboratories include facilities which permit materials processing from the liquid state (casting) as well as in the solid state (powder processing).
The department has its own foundry that houses mold making capabilities (green and bonded sand, permanent mold, and investment casting), induction melting furnaces of various capabilities for air melting of up to 1600 pounds, a dual chamber vacuum induction melting unit with a capacity of up to 30 pounds, a 100 ton squeeze casting press, and state-of-the-art testing and characterization equipment.
The Crystal Growth Laboratory has facilities for production of high purity electronic single crystals using a variety of furnaces with the additional capability of solidifying under large magnetic fields.
Secondary processing and working can be accomplished using a high-speed hot and cold rolling mill, swaging units, and a state-of-the art hydrostatic extrusion press. The department has heat treatment capabilities including numerous box, tube, and vacuum furnaces.
For the processing of powder metals or ceramics the department possesses a 300,000 pound press, a vacuum hot press (with capabilities of up to 7 ksi and 2300 C), a hot isostatic press (2000 C and 30 ksi), a 60 ksi wet base isostatic press, and glove boxes. Sintering can be performed in a variety of controlled atmospheres while a microcomputer-controlled precision dilatometer is available for sintering studies. Several ball mills, shaker mills, and a laboratory model attritor are also available for powder processing. In addition, facilities are available for sol-gel processing, glass melting, diamond machining; a spray dryer is available for powder granulation.
The Mechanical Testing Facility permits the determination of mechanical behavior of materials over loading rates ranging from static to impact, with the capability of testing under a variety of stress states under either monotonic or cyclic conditions. A variety of furnaces and environmental chambers are available to enable testing at temperatures ranging from -196 C to 1800 C. The facility is operated under the guidance of a full-time engineer.
The facility contains one of the few laboratories in the United States for high-pressure deformation and processing, enabling experimentation under a variety of stress states and temperatures. The equipment in this state-of-the-art facility includes:
High Pressure Deformation Apparatus: This unit enables tension or compression testing to be conducted under conditions of high hydrostatic pressure. The apparatus consists of a pressure vessel and diagnostics for measurement of load and strain on deforming specimens, as well as instantaneous pressure in the vessel. Pressures up to 1.0 GPa, loads up to 10kN, and displacements of up to 25 mm are possible.
Hydrostatic Extrusion Apparatus: Hydrostatic extrusion (e.g. pressure-to-air, pressure-to-pressure) can be conducted at temperatures up to 300 C on manually operated equipment interfaced with a computer data acquisition package. Pressures up to 2.0 GPa are possible, with reduction ratios up to 6 to 1, while various diagnostics provide real time monitoring of extrusion pressure and ram displacement.
High Pressure/High Temperature Deformation Apparatus: In addition to the units described above, testing at temperatures up to 1200 C and 1.0 GPa are possible on a recently designed and constructed apparatus which permits conventional hot isostatic pressing (i.e. HIP) as well as triaxial compaction. Experiments can be conducted under load, strain, or stroke control on this servo-hydraulically controlled machine.
The remainder of the equipment in the Mechanical Testing Facility is summarized below:
Servo-hydraulic Machines: Four MTS Model 810 computer-controlled machines with load capacities of 3 kip, 20 kip, 50 kip, and 50 kip, permit tension, compression, and fatigue studies to be conducted under load-, strain-, or stroke control. Fatigue crack growth may be monitored via a dc potential drop technique as well as via KRAK gages applied to the specimen surfaces. Fatigue studies may be conducted at frequencies up to 30 Hz. Universal Testing Machines: Four INSTRON screw-driven machines, including two INSTRON Model 1125 units permit tension, compression and torsion testing.
Electromechanical Testing Machine: A computer-controlled INSTRON Model 1361 can be operated under load-, strain-, or stroke control. Stroke rates as slow as 1 micrometer/hour are possible.
Fatigue Testing Machines: Three Sonntag fatigue machines and two R. R. Moore rotating-bending fatigue machines are available for producing fatigue-life (S-N) data. The Sonntag machines may be operated at frequencies up to 60 Hz.
Creep Testing Machines: Five constant load frames with temperature capabilities up to 800 C permit creep testing, while recently modified creep frames permit thermal cycling experiments as well as slow cyclic creep experiments.
Impact Testing Machines: Two Charpy impact machines with capacities ranging from 20 ft-lbs to 240 ft-lbs are available. Accessories include a Dynatup instrumentation package interfaced with an IBM PC, which enables recording of load vs. time traces on bend specimens as well as on tension specimens tested under impact conditions.
Instrumented Microhardness Testing: A Nikon Model QM High-Temperature Microhardness |Tester has been instrumented to provide load vs. indentation time information on specimens tested at temperatures ranging from -196 C to 1600 C under vacuum and inert gas atmospheres. This unit is complemented by a Zwick Model 3212 Microhardness Tester as well as a variety of Rockwell Hardness and Brinell Hardness Testing Machines.
These facilities include equipment for corrosion, oxidation, and adhesion and wear studies. A wide range of environments can be simulated and controlled: a) Aqueous corrosion: atmospheric, immersion and high pressure/high temperature in autoclaves and b) Oxidation: single and mixed gases over a range of temperatures and pressures. Special items include: electrochemical test equipment, environmental cracking test equipment, vacuum equipment for permeation studies, high sensitivity Cahn electrobalances for thermogravimetric studies and polymer/metal adhesion test fixtures.
Three microscopes are available that provide virtually all transmission electron optical techniques needed for materials research and involve an installed capacity worth $2,000,000. The microscopes available are i) a JEOL 4000 EX 400 keV high resolution machine (point-to-point resolution of 0.19 nm) equipped with a GATAN TV camera (and requisite software for rigorous image interpretation); ii) a Philips CM20 200 keV analytical electron microscope equipped with a Tracor Northern high purity Ge energy dispersive spectroscopy (EDS) detector, a GATAN parallel electron energy loss spectrometer (PEELS) (the combination permitting microanalysis with ~10 nm spatial resolution for all elements between boron and uranium), and a GATAN image intensifier TV system; and iii) a JEOL 200CX 200 keV microscope, with point-to-point resolution of 0.35 nm, for general purpose microstructural analysis and for teaching.
Conventional TEM techniques, such as electron diffraction, bright- and dark-field imaging, and weak-beam dark-field (WBDF), are used routinely to analyze line defects (dislocations) and planar defects (for example, stacking faults) in materials. Specialized techniques, such as convergent beam electron diffraction (CBED) can be used to obtain crystallographic information and determine orientation relationships between different grains in polycrystalline materials, or between different phases in composite materials. The chemistry of microscopic regions (regions between dissimilar phases, or interfacial phases formed by reactions between the matrix and reinforcements) can be investigated using analytical TEM.
Specimen preparation facilities for transmission electron microscopy consist of dimplers, two ion-thinners with four ports, and two electropolishing units for TEM specimen thinning.
Scanning electron microscopy (SEM) and spectrochemical analysis provide valuable specimen investigation with great depth of field and realistic three-dimensional imaging at resolutions up to 100,000X. Determination of the topography of nearly any solid surface is possible. Spectrochemical studies are possible with the use of both wavelength and energy dispersive systems capable of detecting elements from boron to uranium. The department houses a Hitachi S-4500, a field emission electron microscope with two secondary electron detectors, a backscattered electron detector, and an infrared chamber scope. In addition, it has a Noran energy dispersive x-ray detection system and an EBSP detector capable of producing Kikuchi patterns suitable for crystallographic analysis. The microscope is capable of operating at a spatial resolution of less than 1.5 nm at 15 kV. It also performs well at reduced beam energies (1 kV), facilitating the observation of highly insulating materials.
The Center for Surface Analysis of Materials (CSAM) enjoys state-of-the-art characterization of metal, alloy, ceramic, and polymer surfaces. These tools include a PHI 660 Scanning Auger Microprobe (SAM) for elemental analysis of surfaces and mapping, and PHI 3600 Secondary Ion Mass Spectrometry (SIMS), which provides surface sensitivities for species in the part per billion range. A PHI model 5400 instrument provides X-ray Photoelectron Spectroscopy (XPS or ESCA) capability, which produces information concerning chemical states. The latter two instruments are particularly useful for ceramic and polymer surfaces. With specimen heating, cooling, and depth profiling capabilities directly incorporated in these devices, subsurface regions and interfaces in composite structures, as well as at thin film substrate interfacial regions, can be examined and fully characterized.
The ion beam facility for the analysis of materials consists of a NEC 5SDH 1.7 MV tandem pelletron accelerator for the production of 3.4 MeV protons, 5.1 MeV alpha particles, and N ions with energies in excess of 7.0 MeV. Sample analysis takes place in a turbo-molecular pumped high vacuum chamber. The chamber is equipped with a computer-controlled 5 axis manipulator and has provisions for maintaining sample temperatures from 77 K to 1000 K. A Si surface barrier detector, NaI(Tl) scintillator, and a liquid nitrogen-cooled Si(Li) detector are used to detect scattered ions, characteristic gamma rays and characteristic X-rays, respectively.
This instrumentation can non-destructively provide composition and structure information in the near-surface region of materials using techniques such as Rutherford backscattering spectrometry (RBS), ion channeling, particle-induced X-ray analysis (PIXE), and nuclear reaction analysis (NRA). As with other analytic techniques, sensitivity, sampling depth, and depth resolution are sample dependent. However, sensitivities of 1 atomic percent, accuracies of 5%, and a depth resolution of 20 nm are usually easily achieved.
The typical specimen is a solid, vacuum-compatible material with lateral dimensions between 0.5 cm x 0.5 cm and 5 cm x 5 cm. However, PIXE and NRA can also be performed on non-vacuum compatible specimens such as liquids and irreplaceable artifacts of interest to museum curators and archeologists.
The Electronic Characterization Laboratory is equipped for research studies and characterization of electrical properties of semiconductors and other electronic materials. The facility includes a deep level transient Spectroscopy System (DLTS) for the characterization of deep level impurities in semi-conductors, conductance and capacitance measurement techniques, a Hall effect system, and a scanning-tunneling microscope.
The X-ray laboratory contains diffraction equipment for study of the structures of ceramics, metals, polymers, minerals, and single crystals of organic and inorganic compounds. A new Scintag diffractometer system includes a theta/theta wide angle goniometer, a 4.0 kW x-ray generator with copper tube, a third axis stress attachment, a thermoelectrically cooled Peltier germanium detector, a thin film analysis system, a dedicated PC for data acquisition, and a turbomolecular-pumped furnace attachment permitting sample temperatures up to 2000.
The department houses extensive computing equipment for research purposes and also maintains a computer lab expressly for student use, including IBM-compatible and Macintosh computers, laser printers, DECnet terminals, and a VAXstation 2000 with a large screen high resolution display.
Materials Science and Engineering (EMSE)
EMSE 102, Materials Seminar, 1
Topical lectures by faculty on current areas of materials research serving to complement the concepts introduced in EMSE 201. General discussion of overall curriculum and educational objective.
Prerequisite: EMSE 201
EMSE 103, Materials in Sports, 3
The relationships between optimizing sports activities and the performance requirements of sports equipment are developed. The inherent properties of materials are shown to be the controlling factors in the design of almost all types of sports equipment. Properties of the major classes of materials used to manufacture sports equipment are examined. Materials discussed include advanced composites, foams, metals, ceramics and natural composites, e.g., wood and leather. The absorption, storage and release of energy by equipment during sports activities are shown to relate to the basic structure of the materials from which it is made. Demonstration experiments are conducted periodically throughout the course.
EMSE 201, Introduction to Materials Science and Engineering, 3
Bonding, structure, and atomic arrangement in metals, ceramics, semiconductors, and polymeric materials. Principles of processes for microstructural control to obtain desired mechanical and physical properties in materials.
Prerequisite: CHEM 105, CHEM 107 or CHEM 111 and MATH 121 or MATH 123
EMSE 202, Phase Diagrams and Transformations, 3
Diffusion processes, equilibrium diagrams of alloys: solid solutions, phase mixtures, ordering, intermediate phases, binary and ternary diagrams. Thermodynamic, kinetic, and structural aspects of transformation and reactions in condensed systems. Transformations in alloys: phase transformations near equilibrium, precipitation hardening, martensite reactions.
Prerequisite: EMSE 201
EMSE 203, Applied Thermodynamics, 3
Basic thermodynamics principles as applied to materials. Application of thermodynamics to material processing and performance including condensed phase and gaseous equilibria, stability diagrams, corrosion and oxidation, electrochemical and vapor phase reactions.
Prerequisite: CHEM 301
EMSE 210, Materials Laboratory I, 2
Experiments designed to evaluate the microstructure of materials and to evaluate their mechanical and other physical properties: metallography by optical and scanning electron microscopy; mechanical testing; electrical and thermal conductivity; binary phase diagram determination.
Prerequisite: EMSE 201 and concurrent EMSE 202
EMSE 211, Materials Laboratory II, 2
Four groups of experiments running three to four weeks each with approximately three hours of lab time each week. Experiments include: heat-treatment of several steel compositions; processing of an aluminum alloy with melting, casting, forging, and heat treatment; measurement of the strength and deformation of glass, LiF single crystals and other nonmetallic materials; galvanic EMFs between couples of various metals. Formal written report with documentation is required. ENGL 398, technical writing, is associated with EMSE 211.
Prerequisite: EMSE 210
EMSE 260, Transport Phenomena, 4
Fundamentals of momentum transport, mass transport, and heat transport from a unified point of view. Application of these principles to various phenomena in metallurgy and materials science quantitatively treated.
Prerequisite: EMSE 202 and EMSE 210 and MATH 224
EMSE 301, Fundamentals of Materials Processing, 3
Introduction to materials processing technology with an emphasis on the relation of basic concepts to the processes by which materials are made into engineering components. Includes casting, welding, forging, cold-forming, powder processing of metals and ceramics, and polymer and composite processing.
Prerequisite: EMSE 201 and EMSE 202 and EMSE 203
EMSE 302, Fundamentals of Materials Processing Laboratory, 1
Demonstration of basic processes of materials fabrication. Includes visits to commercial materials processing plants for tours and demonstrations. Graded pass/fail
EMSE 303, Mechanical Behavior of Materials, 3
Review of elasticity and plasticity. Basic stress strain relationships of single crystal and poly-crystalline materials. Yield criteria. Microstructural factors controlling deformation and fracture of polycrystalline materials. Strengthening mechanisms. Fracture toughness and fatigue behavior of engineering materials.
Prerequisite: EMSE 201 and ECIV 110
EMSE 307, Foundry Metallurgy, 3
Introduction to solid-liquid phase transformations and their application to foundry and metal casting processes. Includes application of nucleation and growth to microstructural development, application of thermodynamics to molten metal reactions, application of the principles of fluid flow and heat transfer to gating and risering techniques, and introduction to basic foundry and metal casting technology.
Prerequisite: EMSE 202 and EMSE 203 and EMSE 260
EMSE 310, Applications of Diffraction Principles, 1
A lab sequence in conjunction with EMSE 312, Diffraction Principles, involving experiments on crystallography, optical diffraction, Laue backscattering on single crystals, powder diffraction of unknown compounds, electron diffraction and imaging, and chemical analysis using energy dispersive x-ray spectroscopy.
Prerequisite: EMSE 312 (concurrently) or consent of instructor
EMSE 312, Diffraction Principles, 3
Use of x-rays, lasers, and electrons for diffraction studies and chemical analysis of materials. Fourier transforms and optical diffraction. Fundamentals of crystallography. Crystal structures of simple metals, semiconductors and ceramics. Reciprocal lattice and diffraction. Stereographic projections. Powder diffraction patterns and analysis of unknown structures. Laue backscattering and orientation of single crystals. Electron microscopy and electron diffraction. Chemical analysis using energy dispersive x-ray spectroscopy.
Prerequisite: MATH 224, PHYS 221, EMSE 201, or consent of instructor.
EMSE 313, Engineering Applications of Materials, 3
Optimum use of materials taking into account not only the basic engineering characteristics and properties of the materials, but also necessary constraints of component design, manufacture (including machining), abuse allowance (safety factors), and cost. Interrelations among parameters based on total system design concepts. Case history studies. Systems of failure analysis.
Prerequisite: EMSE 202 and ECIV 110
EMSE 314, Electrical, Magnetic, and Optical Properties of Materials, 3
Atomic theory; free electron theory; Fermi-Dirac statistics; density of states; band theory; Brillouin zones. Metals, insulators, and semiconductors. Fermi surface, effective mass; holes, intrinsic, and extrinsic semiconductors. Mobility of carriers; p- junctions; depletion layer; Zener and avalanche diodes; Esaki diode; bipolar transistor; field-effect transistor; MOST. Paramagnetism; diamagnetism; ferromagnetism; antiferromagnetism; ferromagnetism. Luminescence; lasers masers; superconductivity.
Prerequisite: PHYS 221 or PHYS 223 and PHYS 220
EMSE 316, Applications of Ceramic Materials, 3
Engineering applications of ceramics. Survey of processing techniques. Thermal and mechanical properties; strength, thermal conductivity, thermal expansion, stress corrosion. Electrical properties: electrical conductivity, dielectric properties, piezo- and ferro-electricity. Glass manufacture and structure-property relationships.
Prerequisite: EMSE 201
EMSE 396, Special Project or Thesis, 1-36
Special research projects or undergraduate thesis in selected material areas.
EMSE 397, Special Project or Thesis, 1-36
Special research projects or undergraduate thesis in selected material areas.
EMSE 398, Materials Project Laboratory, 1
Independent research project. Projects selected from those suggested by faculty; usually entail original research.
EMSE 399, Materials Project Laboratory, 2
Independent research project. Projects selected from those suggested by faculty; usually entail original research.
EMSE 401, Transformations in Materials, 3
Review of solution thermodynamics, surfaces and interfaces, recrystallization, austenite decomposition, the martensite transformation and heat treatment of metals.
Prerequisite: EMSE 202
EMSE 403, Modern Ceramic Processing, 3
Fundamental science and technology of modern ceramic powder processing and fabrication techniques. Powder synthesis techniques. Physical chemistry of aqueous and nonaqueous colloidal suspensions of solids. Shape forming techniques: extrusion; injection molding; slip and tape casting; dry, isostatic, and hot isostatic pressing.
Prerequisite: EMSE 316
EMSE 404, Diffusion Processes in Solids and Melts, 3
Development of the laws of diffusion and their applications. Carburization and decarburization oxidation processes; phase transformations.
Prerequisite: EMSE 202
EMSE 405, Dielectric, Optical and Magnetic Properties of Materials, 3
Electrical properties of nonmetals: ionic conductors, dielectrics, ferroelectrics, and piezo-electrics. Magnetic phenomena and properties of metals and oxides, including superconductors. Mechanisms of optical absorption in dielectrics. Optoelectronics. Applications in devices such as oxygen sensors, multilayer capacitors, soft and hard magnets, optical fibers, and lasers.
Prerequisite: EMSE 314
EMSE 407, Solidification of Materials, 3
Fundamental science of solid-liquid phase transformations and the application of these basics to the solidification processing of materials. Includes nucleation and growth, heat and solute transport, rapid solidification, and an overview of solidification processing techniques. Emphasis is on the effect of solidification and solidification processing on resulting microstructure.
Prerequisite: EMSE 201 and EMSE 301
EMSE 409, Deformation Processing of Metals, 3
Flow stress as a function of material and processing parameters; yielding criteria; stress states in elastic-plastic deformation; forming methods: forging, rolling, extrusion, drawing, stretch forming, composite forming.
Prerequisite: EMSE 303
EMSE 411, Environmental Effects on Materials Behavior, 3
Aqueous corrosion; principles and fundamental concepts; recognition of modes; monitoring and testing; methods to control and prediction. Applications of engineering problems: design, and economics. Mixed potential theory, principles of protection, hydrogen effects, and behavior in metal systems.
EMSE 412, Materials Science and Engineering Seminar, 0
EMSE 413, Fundamentals of Materials Engineering and Science, 3
Provides a background in materials for graduate students with undergraduate majors in other branches of engineering and science: reviews basic bonding relations, structure, and defects in crystals. Lattice dynamics; thermodynamic relations in multi-component systems; microstructural control in metals and ceramics; mechanical and chemical properties of materials as affected by structure; control of properties by techniques involving structure property relations; basic electrical, magnetic and optical properties
EMSE 417, Properties of Materials at High Temperatures, 3
Thermo physical properties: specific heat, thermal expansion, electrical and thermal conductivity. Temperature dependence of elastic constants. Thermodynamic principles for the stability of microstructures at high temperatures. Strengthening mechanisms. Stress relaxation and damping. Creep deformation. Thermal fatigue and thermal shock. Fracture mechanisms. Refractory metals, superalloys, intermetallic compounds, carbon, caramic materials. Protective coatings.
EMSE 418, Oxidation of Materials, 3
Experimental techniques; thermodynamics of oxidation reactions; defects and diffusion in oxide; oxidation rate laws. Effects of alloying, surface treatment and stress on oxidation. High-temperature corrosion.
EMSE 419, Phase Equilibria and Microstructures of Materials, 3
The multi-component nature of most material systems require understanding of phase equilibria and descriptions of microstructure. Attention will be given to phase equilibria in multi-component (ternary and higher) systems, and the stereological description of the microstructure of multiphase systems.
EMSE 420, Powder Processing, 3
Fundamental science and technology of modern metal powder processing and fabrication techniques. Includes powder synthesis, characterization, consolidation mechanisms and practices, effects of atmosphere, diffusional homogenization processing, and applications of powder metallurgy.
EMSE 421, Fracture of Materials, 3
Micromechanisms of deformation and fracture of engineering materials. Brittle fracture and ductile fracture mechanisms in relation to micro structure. Strength, toughness, and test techniques. Review of predictive models.
Prerequisite: ECIV 110 and EMSE 303 or EMSE 427
EMSE 426, Semiconductor Technology, 3
Fundamental science and technology of modern semiconductors. Thin film technologies for electronic materials. Crystal growth techniques. Introduction into device technology. Defect characterization and generation during processing properties of important electronic materials for device applications.
Prerequisite: EMSE 314
EMSE 427, Dislocations in Solids, 3
Elasticity and dislocation theory; dislocation slip systems; links and dislocation motion; jogs and dislocation interactions, dislocation dissociation and stacking faults; dislocation multiplication, applications to yield phenomena, work hardening and other mechanical properties.
EMSE 429, Crystallography and Crystal Chemistry, 3
Crystal symmetries, point groups, translocation symmetries, space lattices, crystal classes, space groups, crystal chemistry, crystal structures and physical properties.
EMSE 502, Mechanical Properties of Metals and Composites, 3
Microstructural effects on strength and toughness of advanced metals and composites. Review of dispersion hardening and composite strengthening mechanisms. Toughening of brittle materials via composite approaches such as fiber reinforcement, ductile phases, and combinations of approaches.
Prerequisite: ECIV 110 and EMSE 303 or EMSE 421
EMSE 504, Thermodynamics of Solids, 3
Review of the first, second, and third laws of thermodynamics and their consequences. Stability criteria, simultaneous chemical reactions, binary and multi-component solutions, phase diagrams, surfaces, adsorption phenomena.
EMSE 511, Failure Analysis, 3
Methods and procedures for determining the basic causes of failures in structures and components. Recognition of fractures and excessive deformations in terms of their nature and origin. Development and full characterization of fractures. legal, ethical, and professional aspects of failures from service.
Prerequisite: EMSE 201 or EMSE 103 and ECIV 110
EMSE 514, Defects in Semiconductors, 3
Presentation of the main crystallographic defects in semiconductors; point defects (e.g. vacancies, interstitials, substitutional and interstitial impurities, line defects (e.g. grain boundaries). Structural, electrical and optical properties of various defects. Interpretation of the properties from the perspective of semiconductor physics and materials science and correlation of these defects to physical properties of the material. Experimental methods including TEM, EBIC, CL, DLTS, etc.
Prerequisite: EMSE 426
EMSE 515, Analytical Methods in Materials Science: Lecture, 3
The common advanced analytical methods used in materials science are TEM, SEM, SAM, SIMS, and ESCA. These acronyms will be defined and the theory and application of each will be explained.
EMSE 516, Analytical Methods in Materials Science: Laboratory, 3
A laboratory course designed to assume proficiency in TEM, SEM, SIMS, and ESCA.
EMSE 601, Independent Study, 1-36
EMSE 633, Special Topics, 1-36
EMSE 649, Special Projects, 1-36
EMSE 651, Thesis M.S., 1-36
Required for master's degree. A research problem in metallurgy, ceramics, electronic materials, biomaterials or archeological and art historical materials, culminating in the writing of a thesis.
EMSE 701, Dissertation Ph.D., 1-36
Required for Ph.D. degree. A research problem in metallurgy, ceramics, electronic materials, biomaterials or archeological and art historical materials, culminating in the writing of a thesis.
BACHELOR OF SCIENCE IN ENGINEERING DEGREE
MAJOR IN MATERIALS SCIENCE AND ENGINEERING
Fall Semester | Class/Lab/Credit Hours | Spring Semester | Class/Lab/Credit Hours |
|
FRESHMAN |
| CHEM 107, Properties and Structure of Matter I | (3-0-3) b | CHEM 108, Properties and Structure of Matter II | (3-0-3)b |
| CMPS 131, Elementary Computer Programming | (3-0-3) | CHEM 113, Principles of Chemistry Laboratory | (1-3-2) |
| ENGL 150, Expository Writing | (3-0-3) | MATH 122, Calculus for Science and Engineering II | (4-0-4) |
| MATH 121, Calculus for Science and Engineering I | (4-0-4) | PHYS 121, General Physics I. Mechanics | (3-1-4)c |
| PHED 201, Physical Education Activities | (0-3-0) | PHED 102, Physical Education Activities | (0-3-0) |
| Open elective or humanities/social science | (3-0-3) d | Humanities/social science or open elective | (3-0-3)d |
| Total | (16-3-16) | Total | (14-7-16) |
|
SOPHOMORE |
| CHEM 301, Introduction to Physical Chemistry | (3-0-3) e | ECMP 251, Numerical Methods or PHYS 249, Mathematical Physics and Computing | (3-0-3)
(3-0-3) |
| EMSE 201, Introduction to Materials Science | (3-0-3) e | or EMAE 250, Computers in Mechanical Engineering | (3-0-3) |
| EMSE 102, Materials Science Seminar | (1-0-1) | EMSE 202, Phase Diagrams & Phase Transformations | (3-0-3) |
| MATH 223, Calculus for Science and Engineering III | (3-0-3) | EMSE 210, Materials Laboratory I | (0-3-2) |
| PHYS 122, General Physics II. Electricity & Magnetism | (3-1-4) | MATH 224, Elementary Differential Equations | (3-0-3) |
| Humanities or Social Science Sequence I | (3-0-3) | PHYS 221, General Physics III. Modern Physics | (3-1-4) |
| | Humanities or Social Science Sequence II | (3-0-3) |
| Total | (17-0-17) | Total | (15-3-17) |
|
JUNIOR |
| ECIV 110, Mechanics | (3-0-3) e | EMSE 211, Materials Laboratory II | (0-3-2) |
| EEAP 240, Electronic Circuits I | (3-2-4)e | EMSE 260, Transport Phenomena | (4-0-4) |
| EMSE 203, Applied Thermodynamics | (3-0-3) | EMSE 303, Mechanical Behavior of Materials | (3-0-3) |
| PHYS 205, General Physics Laboratory | (0-4-2) | Open elective | (3-0-3) |
| Humanities or Social Science Sequence III | (3-0-3) | ENGL 398, Professional Communication | (2-0-2) |
| Open Elective | (3-0-3) | Humanities or Social Science Sequence IV | (3-0-3) |
| Total | (15-6-18) | Total | (15-3-17) |
|
SENIOR |
| EMSE 301, Fundamentals of Materials Processing | (3-0-3) | EMSE 313, Engineering Applications of Materials | (3-0-3) |
| EMSE 302, Fundamentals of Materials Processing Laboratory | (0-3-1) | EMSE 399, Materials Projects Laboratory | (0-4-2) |
| EMSE 317, Diffraction Principles and Applications | (3-2-4) | Humanities or social science elective | (3-0-3) |
| EMSE 314, Electronic, Magnetic, and Optical Properties of Materials | (3-0-3)e | Technical elective | (3-0-3) |
| EMSE 398, Materials Projects Laboratory | (0-2-1) | Technical elective | (3-0-3) |
| Technical elective | (3-0-3) | |
| Humanities or social science elective | (3-0-3) | |
| Total | (15-7-18) | Total | (12-4-14) |
Hours required for graduation: 133 plus engineering graphics proficiency. a
a By completing EMAE 192 as an open elective or passing a graphics proficiency exam.
b Students may take CHEM 105-106, Principles of Chemistry I-II, in place of CHEM 107-108.
c Selected students may be invited to take PHYS 123-124-223, Physics and Frontiers I-II-III, in place of PHYS 121-122-221.
d One of these courses must be in the humanities or social sciences.
e Engineering Core Course.
f EEAP 243 and 244 together can be substituted for EEAP 240 and 4 hours of technical electives.
The following courses are approved technical electives in Materials Science & Engineering. A student may focus on an area of particular interest by choosing courses from one category, but this is not required. Students may request approval of other elective sequences by submitting a written petition justifying their choices to the DMSE Undergraduate Studies Committee.
EIND 250, Production Systems Management
EMAC 270, Introduction to Polymer Science
EEAP 309, Electromagnetic Fields I
EMSE 316, Applications of Ceramic Materials
EEAP 321, Semiconductor Electronic Devices
PHYS 335, Introduction to Solid State Physics
EMSE 401, Transformations in Materials
EMSE 404, Diffusion Processes in Solids and Melts
EMSE 405, Dielectric, Optical, and Magnetic Properties of Materials
EMSE 417, Properties of Materials at High Temperatures
EMSE 419, Phase Equilibria and Microstructure of Materials
EMSE 421, Fracture of Materials
EMSE 424, Properties of Metallic Ceramics
EMSE 427, Dislocations in Solids
EMSE 429, Crystallography and Crystal Chemistry
EMSE 430, Grain Boundaries, Interfaces, and Surfaces of Materials Metallurgy
ECIV 210, Strength of Materials
EIND 250, Production Systems Management
EMSE 307, Foundry Metallurgy
EMSE 401, Transformations in Materials
EMSE 407, Solidification
EMSE 409, Deformation Processing of Metals
ECIV 410, Advanced Strength of Materials
EMSE 411, Environmental Effects on Materials Behavior
ECIV 415, Modeling and Experimental Methods
EMSE 417, Properties of Materials at High Temperatures
EMSE 418, Oxidation of Materials
EMSE 420, Powder Processing
EMSE 421, Fracture of Materials
EMSE 427, Dislocations in Solids
ECIV 210, Strength of Materials
EIND 250, Production Systems Management
EMSE 316, Application of Ceramic Materials
EMSE 403, Modern Ceramic Processing
EMSE 405, Dielectric, Optical, and Magnetic Properties of Materials
ECIV 410, Advanced Strength of Materials (prereq: ECIV 210)
EMSE 417, Properties of Materials at High Temperatures
EMSE 419, Phase Equilibria and Microstructure of Materials
EMSE 421, Fracture of Materials
EMSE 424, Properties of Metallic Ceramics
EMSE 427, Dislocations in Solids
EMSE 429, Crystallography and Crystal Chemistry Electronic Materials
EEAP 243, Electronic Circuits Laboratory
EEAP 244, Electronic Circuits, Signals, & Systems
EIND 250, Production Systems Management
EEAP 309, Electromagnetic Fields I
EEAP 321, Semiconductor Electronic Devices
PHYS 333, Introduction to Quantum Mechanics
PHYS 335, Introduction to Solid State Physics
EMSE 401, Transformations in Materials
EMSE 405, Dielectric, Optical, and Magnetic Properties of Materials
EMSE 426, Semiconductor Technology
CWRU Provost's Office --
About this server
-- Copyright 1996 CWRU
-- Unauthorized use prohibited
|